Following unproven claims that the liquid metal cooling in the original PlayStation 5 (PS5) could leak and damage the machine, Sony has published a new teardown of the PS5 Pro highlighting modifications to its cooling apparatus.
The alterations include refinements to the PS5’s liquid metal cooling design to provide “more stable” cooling, adding grooves where the liquid metal is applied to the design’s basic structure.
Sony quotes PS5 Pro Mechanical Design Lead Shinya Tsuchida, who says the company anticipated semiconductors would become more dense and so leaned on liquid metal technology, which turned out to be “integral when designing the PS5 Pro”.
iFixit’s teardown of the new console noted a larger cooling fan with redesigned blades as well as a harder-to-see motherboard which hides extra layers to speed up memory access.